>                *** CALL FOR PAPERS ***
> 
> 23rd IEEE International SoC Conference (SOCC 2010)
> 
> Sponsored by IEEE Circuits and System Society
> 
> September 27-29, 2010
> Bally’s Las Vegas – Nevada – USA
> 
> The SOC Conference provides a premier forum for sharing advances in SoC
> technologies and applications in the areas of digital systems, circuit
> architectures, design methods, tools and automation, manufacturing
> and test, and emerging MEMS and nano technologies.
> 
> The 23rd SOCC will be held in Las Vegas, Nevada, and will offer three days
> of technical papers, technical workshops, and a vendor exhibition. Please check
> our website regularly for updates.
> 
> SUBMISSION OF PAPER AND WORKSHOP/TUTORIAL PROPOSALS:
> Electronic paper submissions require a full paper in pdf format,
> limited to four double-column IEEE format pages, and including
> figures and references. SOCC 2010 also welcomes workshop and
> tutorial proposals in the related areas of SoC.
>
> A proposal with title, a half-page summary, and speaker's short bio
> should be submitted to the Workshop Chair by April 26, 2010. For
> corporate sponsorship and exhibition, please contact the SoC
> Conference office. The SOCC proceedings will be published by
> the IEEE Xplore®. Papers are invited which address new and
> previously unpublished results in the area of Systems on Chip,
> and related topics.
> 
> •       Analog, Mixed-Signal and RF Circuits and Systems
> •       Digital Signal Processing (DSP) Circuits and Systems (Video,
>         Multimedia, Control etc.)
> •       Embedded Systems, Multi/Many Core Systems and Embedded
>         Memory Technologies
> •       Wireline & Wireless Communication Circuits and Systems
> •       System Level Design Methodology, EDA and Design Tools for SoC
> •       Reconfigurable and Programmable Circuits and Systems, System on
>         Programmable Devices (FPGAs)
> •       Low-Power Circuits, Systems and Design Methodologies
> •       Signal Integrity, Design for Testability and Design Verification
> •       Design for Manufacturability, Variation-aware Methodologies
> •       Network on Chip (NoC) & Interconnects
> 
> Paper submission deadline:          April 19, 2010
> Notification of acceptance:         June 11, 2010
> Final camera-ready paper due:       June 25, 2010
> 
> ORGANIZING COMMITTEE
> Conference General Chair:           Thomas Buechner, IBM
> Conference Co-Chair:                Andrew Marshall , Texas Instruments
> Technical Program Chair:            Ramalingam Sridhar, SUNY Buffalo
> Technical Program Co-Chair:         Norbert Schuhmann, FHG IIS
> Steering Committee Chair:           Sakir Sezer, Queen’s Univ. Belfast
> Publicity Chair:                    Kaijian Shi, Synopsys
> Workshop Chair:                     Nagi Naganathan, LSI
> Local Committee:                    Venkatesan Muthukumar, UNLV
>                                     Emma Regentova, UNLV
>
> Please visit the conference web site http://www.ieee-socc.org
> or contact the SoC Conference office at info@ieee-socc.org
> for current conference information
>
> 
>
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